The new release got a new name: Autodesk Simulation Moldflow Insight. Also the flovor names have changed:
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Here is an overview about the new features:
Autodesk Vault integration
The ability to integrate with Autodesk Vault data management software products is now available at no cost for Autodesk Simulation Moldflow Adviser and Autodesk Simulation Moldflow Insight products. Autodesk Vault products organize, manage, and track data creation, simulation, and documentation processes for design and engineering workgroups.
Improved Autodesk Inventor Fusion software available
Autodesk Inventor Fusion software is a fully fledged, history-free CAD modeler that is included at no additional cost with the Autodesk Simulation Moldflow Adviser and Autodesk Simulation Moldflow Insight products. The Autodesk Inventor Fusion product now allows you to modify part geometry even more efficiently, regardless of the CAD system in which it was created or the existence of parametric relationships in the model.
Additional license-free CAD formats available for import
Autodesk Simulation Moldflow Insight, Autodesk Simulation Moldflow Adviser, and Autodesk Simulation Moldflow CAD Doctor Products now can import Autodesk Inventor, Autodesk Alias, and SAT files, without having to install an additional product or requiring an additional license.
Consolidated Autodesk Simulation Moldflow Design Link available
Additional CAD import formats are available through a newly consolidated, licensed version of Autodesk Simulation Moldflow Design Link.
Autodesk Simulation Moldflow CAD Doctor update
A solid CAD model which has been read into Autodesk Simulation Moldflow CAD Doctor can now be exported as a solid model included in a Study (*.sdy) file. These Study files then can be imported into Autodesk Simulation Moldflow Insight or Autodesk Simulation Moldflow Adviser.
Improved user interface efficiency
Enhancements have been implemented to significantly improve the performance of the graphical user interface.
Crystallization analysis option for Midplane and Dual Domain analyses of Thermoplastics Injection Molding applications
An option to perform Crystallization analysis has been implemented for analyses of the Thermoplastics Injection Molding process using Midplane and Dual Domain analysis technology. Modeling the flow-induced crystallization and morphological changes of semi-crystalline materials can improve the accuracy of prediction of cavity pressure decay and the mechanical properties of the molded parts, and subsequent shrinkage and warpage predictions.
Transient Cool (FEM) solver enhanced to support Dual Domain models and additional molding processes
The transient mold temperature analysis options have been expanded to include the Reactive Molding and Microchip Encapsulation processes for 3D analysis technology. Support for Dual Domain models is now also included for the Thermoplastics Injection Molding process. For those systems with an installed CUDA-enabled GPU (Graphics Processing Unit) card capable of double precision computations, the software will now automatically use it to improve the analysis time.
Fiber breakage calculation option available for analyses of long-fiber filled thermoplastic materials
The option to Calculate fiber breakage is now available when performing a Fiber orientation analysis if the selected material is a long-fiber filled composite.
Fiber orientation analysis option extended to 3D analyses using thermoset composite materials
The option to perform Fiber orientation analysis if fiber material has been implemented for analyses of Reactive Molding and Microchip Encapsulation processes using 3D analysis technology. This enables the same fiber orientation model options that were previously implemented for 3D analyses of thermoplastics molding processes.
3D Microchip Encapsulation improvements for Wire Sweep and Paddle Shift analyses
For Wire Sweep analyses of Microchip Encapsulation processes using 3D analysis technology, it is now possible to assign multiple wire material properties in the same model to better represent actual wire types used in manufacturing. In addition, new analysis sequences combining Paddle Shift (or Dynamic Paddle Shift) with Wire Sweep in the same sequence are available.
Solver enhancements address accuracy and speed
Enhancements have been implemented to improve the performance of analysis solvers.
Matelial database changes
Changes to the material database that have been implemented since the release of Autodesk Moldflow 2012, Service Pack 1, are summarized here.